Various LID for SMD
-YOSHIKAWA- with pioneering technology will changes the world
Crystal elements / Saw filters / LID for Sensors
The world wide top leader for SMD precision sealing solutions - YOSHIKAWA
-ACE INTERNATIONAL CORPORATION- We are YOSHIKAWA's only designated sales agent in China for over 20 years
YOSHIKAWA "LID" feature
- Global market share No.1
- In 1988, completed the first-ever mass production of LID for SMD, using the stamping press technology.
- YOSHIKAWA offers special packing with original taping and pallet packaging.
- YOSHIKAWA has special centrifugal barrel grinder to remove punching burrs.
Product type, special specifications
Flat LID
Ladder LID
Hole LID
AuSn LID (Au, Sn, Au multilayer plating)
AgCu LID (Ag, Cu multilayer plating)
Various acute angle stretching products
Specification
- Seam Sealing type Electro Ni-plated products
- Seam Sealing type Electroless Ni-plated products (P=8~10%)
- AuSn sealing type AuSn plating (Au, Sn, Au multilayer)
- AgCu sealing type AgCu plating
- Other specifications
Size
Recorded production of LID varying from the PKG size of 0.8x0.6 to large-size.
- Crystal (PKG) : General products ranging from 1008 to 7050, the smallest can be produced from 0806
- SAW (PKG) : 2520~25x9 can be produced
- Sensor : different sizes available, LID with holes can be custmized from Φ0.15 min.
Thickness
Material assurance from 0.04t (other thicknesses need to be negotiated)
Unit: mm
| Flat LID | Ladder LID |
|---|---|
| 0.04t | 0.18t/0.1t |
| 0.05t | 0.2t/0.1t |
| 0.06t | |
| 0.07t | |
| 0.08t | |
| 0.10t | |
| 0.125t |
| Flat LID | 0.04t | 0.05t | 0.06t | 0.07t | 0.08t | 0.10t | 0.125t |
|---|---|---|---|---|---|---|---|
| Ladder LID | 0.18t/0.1t | 0.2t/0.1t |
Material
Made by Hitachi Metals Neomaterial,ltd. 29%Ni17%Co Fe (equivalent to ASTM F15)
Burrless processing
Yoshikawa uses a special centrifugal barrel grinder to remove punching burrs.
"Yoshikawa"
special centrifugal barrel grinding method
"Other Company"
Chemical grinding method
In the case of chemical grinding,end faces are taperd, and reducing LID's contct area with the PKG.
Product packaging
- Bag packaging
- Special taping packaging
- Special pallet packaging