Our Business

Component and Processing section

Various LID for SMD / Au CAP / Ultra precision machining / Cover glass processing etc.

Various LID for SMD

Au CAP

Ultra precision machining

Cover glass processing

Material and Raw material section

BeCu (beryllium copper) / Ferric oxide (for ferrite core) / Ingot & wafer / Special glass etc.

BeCu (beryllium copper)

Ferric oxide (for ferrite core)

Ingot & wafer

Special glass

Equipment and Testing instrument section

Powder compression press / Lapping & polishing machine / B-H analyzer / X-ray crystal orientation unit etc.

Powder compression press

Lapping & polishing machine

B-H analyzer

X-ray crystal orientation unit

Green energy section

Cutting & grinder for Silicon / Back grinder / Multi wire saw for silicon / Powder material equipment etc.

Cutting & grinder for Silicon

Back grinder

Multi wire saw for silicon

Powder material equipment