Our Business
Component and Processing section
Various LID for SMD / Au CAP / Ultra precision machining / Cover glass processing etc.
Various LID for SMD
Au CAP
Ultra precision machining
Cover glass processing
Material and Raw material section
BeCu (beryllium copper) / Diamond Wire / Ferric oxide (for ferrite core) / Ingot & wafer etc.
BeCu (beryllium copper)
Diamond Wire
Ferric oxide (for ferrite core)
Ingot & wafer
Equipment and Testing instrument section
CCD Visual Detector / Lapping & polishing machine / B-H analyzer / X-ray crystal orientation unit etc.
CCD Visual Detector
Lapping & polishing machine
B-H analyzer
X-ray crystal orientation unit
Green energy section
Cropping for Silicon / Twin Squaring for Silicon / Squaring & Grinding Combined Machine / Powder material equipment etc.
Cropping for Silicon
Twin Squaring for Silicon
Squaring & Grinding Combined Machine
