Our Business
Component and Processing section
Various LID for SMD / Au CAP / Ultra precision machining / Cover glass processing etc.
Various LID for SMD
Au CAP
Ultra precision machining
Cover glass processing
Material and Raw material section
BeCu (beryllium copper) / Ferric oxide (for ferrite core) / Ingot & wafer / Special glass etc.
BeCu (beryllium copper)
Ferric oxide (for ferrite core)
Ingot & wafer
Special glass
Equipment and Testing instrument section
Powder compression press / Lapping & polishing machine / B-H analyzer / X-ray crystal orientation unit etc.
Powder compression press
Lapping & polishing machine
B-H analyzer
X-ray crystal orientation unit
Green energy section
Cutting & grinder for Silicon / Back grinder / Multi wire saw for silicon / Powder material equipment etc.
Cutting & grinder for Silicon
Back grinder
Multi wire saw for silicon
